Today, the manufacture of prototypes, first run parts, or components necessary to sustain the life cycle of a given assembly, are completely dependent on source data.  Various methods of data creation, collection, distribution, and manipulation all contribute to the integrity of the data being manufactured or repaired.  Accuracy from data collection devices, data interoperability, and integration to downstream applications like CAM (computer-aided manufacturing) all contribute to target data integrity.  The distribution of that data is dependant on its accessibility.

In a depot environment, the ability to acquire accurate, up-to-date, 3D measurements of the equipment is obviously extremely valuable.  Models can be constructed based on the measurements that allow design work and prototyping to be done with less trial and error of physical objects.  Practical systems are available for generating computer models and producing prototypes through the use of 3D printers.  Methods for scanning in the 3D shapes of existing objects or spaces are not as well developed.  Though methods do exist for scanning 3D objects and facilities, all suffer from application-specific drawbacks.  An improved and more precise method of 3D model generation holds tremendous value to the DOD maintenance depots for manufacturing, inspection, and prototyping.

Majority of current 3D systems require the scan of an object with a laser beam or contact stylus to generate a cloud of points from which a model is developed.  These systems have several disadvantages including high cost, large size and weight, and significant modeling time. The OptiCAM will take advantage of ongoing development of Spatial Integrated Systems, Inc.’s optical 3D digital video capture device to attack these issues.

The cloud of points generated by laser measurements requires substantial processing to produce usable solid body models.  The proposed OptiCAM approach directly measures surfaces and is therefore inherently better suited for 3D model generation.  SIS’s digital video capture device is already producing highly accurate models in a laboratory environment, though more development is required to create a production system that meets DOD requirements.  Among the problems to be addressed are obtaining line of sight to the surfaces to be measured, and handling variable lighting conditions.  The system must be rugged and affordable. It should also be easy to set up and take down and not require a highly skilled operator.  It is intended that models generated will not require extensive processing before entering the manufacturing process.  The data should be capable of translation into formats required by commercial off-the-shelf CAD/CAM and modeling software.

Today’s methods of manual data collection and/or manual drawing generation are inefficient and inaccurate.  They inherently produce re-work.  Moving forward, a revolutionary system will be described that will automate 3D data collection, distribute that data accurately, and ultimately maintain the associative integrity of that model all through the manufacture.

Project manager is Tony Haynes, 734-995-4930.

New project approved:  Isotropically Conductive Adhesives

There is a resolute market drive to eliminate lead-containing solders from all commercial electronics.  This push is coming mainly from foreign electronics manufacturers, particularly in Japan and Europe, who plan to ban lead solders within the next few years.  Japanese consumer electronics companies are presently pushing a voluntary ban on lead with an initiative to eliminate lead from all consumer electronics in 2003.  Europe is now following suit, with an initiative aimed at eliminating lead from all products by 2006.

While U.S. companies are developing lead-free alternatives, there are several complicated issues associated with the development and use of lead-free solder alloys, the most overwhelming of which is their high reflow temperatures and incompatibility with lead (Pb).  These high reflow temperatures could potentially wreak havoc on some presently-used electronic materials, manufacturing processes, and associated components.  Contamination of Pb in the Pb-free solder joint degrades the reliability of the joint, which severely affects the reliability of electronic components.  Because the long service life of military electronic components will necessitate bonding to components that still contain Pb, this reliability concern is a major issue.  Commercially available metallic-filled isotropically conducting adhesives (ICAs) offer a promising alternative to solders for joining electronic components for printed wire boards. 

Another advantage of the use of polymer replacements for solder alloys is the ability to rework the interconnection at a much lower temperature, thereby eliminating degradation to the substrate.  The higher melting temperatures of Pb-free solders make removal of devices much more difficult because of the risk of board delamination and damage of adjacent components.  Since both a thermoset and thermoplastic adhesive will be developed during this effort, rework can be performed by either heating or solvent exposure.  However, there are several significant barriers to the widespread use of silver-filled ICAs including mechanical reliability, conductivity degradation, the potential for silver migration, and the high cost of silver powder.  The cost of copper metal, at approximately $1 per lb. versus $100 per lb. for silver is a powerful economic enabler to the wider use of copper-filled isotropic conductive adhesives.

To address these needs, the ICA team is developing a new technology, ECORAP (electrically-conducting, oxidation-resistant adhesion promoter), which could greatly enhance the performance and cost of ICAs.  The key advantage of ECORAP technology is that it allows the use of copper particles as the conductive filler, thus replacing the costly and deficient silver filler.  This project builds off the results from an Air Force sponsored Phase II SBIR program. 

NCMS Program Manager is Lee Patch, 734-995-4972.