Isotropically Conductive Adhesives

A world-wide legislative drive is underway to eliminate lead-containing solders from all electronics. Alternative lead-free solders have several problems: temperature, mechanical performance, wettability, and cost. Lead-free solder alloys have 34°C higher reflow temperature than eutectic lead solders which:

• Degrades some electronic polymers

• Increases moisture related failure mechanism (“popcorning”) in plastic encapsulants

• Necessitates new or refurbished reflow ovens

• Adds cost and time to manufacturing

Isotropically conducting adhesives offer a low processing temperature solution. Through this CTMA program, the NCMS project team will develop a low cost, corrosion resistant, environmentally friendly, copper-filled ICA that overcomes problems associated with lead-free solders and silver adhesives in most electronic applications.

Program Manager: Lee Patch, (734) 995-4972, leep@ncms.org